| 专利名称 | Packaging structure of light emitting diode and method of manufacturing the same | 申请号 | US201214232443 | 专利类型 | US | 公开（公告）号 | US9246052(B2) | 公开（授权）日 | 2016.01.26 | 申请（专利权）人 | 中国科学院半导体研究所 | 发明（设计）人 | Li Jinmin;Yang Hua;Yi Xiaoyan;Wang Junxi | 主分类号 | H01L21/00 | IPC主分类号 | H01L21/00;H01L27/15;H01L29/22;H01L33/06;H01L33/48;H01L33/62;H01L23/00;H01L33/00;H01L33/56;H01L33/58;H01L33/38 | 专利有效期 | Packaging structure of light emitting diode and method of manufacturing the same 至Packaging structure of light emitting diode and method of manufacturing the same | 法律状态 | 说明书摘要 | The present disclosure relates to a light emitting diode packaging structure and the method of manufacturing the same. The light emitting diode packaging structure has an insulating substrate with through holes formed on each side of the upper surface thereof, the through hole being filled with conductive metal. Additionally, a n-type layer, an active layer, a p-type layer, an insulating layer and a p-type electrode are formed on the insulating substrate. The structure further may include a n-type electrode provided on a side of the upper surface of the n-type layer; a first back electrode provided at one side of the back surface of the insulating substrate; a second back electrode provided at the other side of back surface of the insulating substrate; and an optical element packaged on the base substrate. |
1、源头对接，价格透明
2、平台验证，实名审核
3、合同监控，代办手续
4、专员跟进，交易保障