| 专利名称 | Solid hole array and method for forming the same | 申请号 | US201213697372 | 专利类型 | US | 公开（公告）号 | US9136160(B2) | 公开（授权）日 | 2015.09.15 | 申请（专利权）人 | 中国科学院微电子研究所 | 发明（设计）人 | Dong Lijun;Zhao Chao | 主分类号 | H01L23/498 | IPC主分类号 | H01L23/498;H01L21/768;H01L23/14;H01L21/48 | 专利有效期 | Solid hole array and method for forming the same 至Solid hole array and method for forming the same | 法律状态 | 说明书摘要 | A solid hole array and a method for forming the same are disclosed. The solid hold array may comprise: substrate with a via; a top hole array base formed on a top surface of the substrate and a bottom hole array base formed on a bottom surface of the substrate, wherein a front hole is located in the top hole array base at a place corresponding to the via; and top protection layer formed on a surface and sidewalls of the top hole array base and a bottom protection layer formed on a surface of the bottom hole array base, wherein a rear window is located in the bottom hole array base and the bottom protection layer at a place corresponding to the via. |
1、源头对接，价格透明
2、平台验证，实名审核
3、合同监控，代办手续
4、专员跟进，交易保障