Process for fabricating an ultra-low-resistance superconducting joint having high shielding characteristics

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专利名称 Process for fabricating an ultra-low-resistance superconducting joint having high shielding characteristics 申请号 US201013516039 专利类型 US 公开(公告)号 US8745851(B2) 公开(授权)日 2014.06.10 申请(专利权)人 中国科学院电工研究所 发明(设计)人 WANG QIULIANG;HU XINNING;SONG SHOUSEN;DING LIJIAN;YAN LUGUANG 主分类号 H01B12/10 IPC主分类号 H01B12/10 专利有效期 Process for fabricating an ultra-low-resistance superconducting joint having high shielding characteristics 至Process for fabricating an ultra-low-resistance superconducting joint having high shielding characteristics 法律状态 说明书摘要 A process for fabricating an ultra-low-resistance superconducting joint that has high shielding characteristics. The process includes: corroding copper on the outer surface at the end of a NbTi/Cu superconducting wire to form terminal NbTi superconducting filaments; inserting same number of NbTi superconducting filaments into each through hole of the niobium layer of a Nb/NbTi/Cu multilayer composite rod; pressing at the outside of the Nb/NbTi/Cu multilayer composite rod to combine the Nb/NbTi/Cu multilayer composite rod and NbTi superconducting filaments together to form a joint; and inserting the joint into a YBCO tube, and then filling the YBCO tube with molten bismuth-lead-tin-cadmium (BiPbSnCd) alloy solder to form a superconducting joint with high shielding and low resistance characteristics.

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