| 专利名称 | A NANO CRYSTALS COPPER MATERIAL WITH SUPER HIGH STRENGTH AND CONDUCTIVITY AND METHOD OF PREPARING THEREOF | 申请号 | EP20030757640 | 专利类型 | EP | 公开（公告）号 | EP1567691(B1) | 公开（授权）日 | 2012.08.22 | 申请（专利权）人 | 中国科学院金属研究所 | 发明（设计）人 | LU, LEI;SI, XIAO;SHEN, YONGFENG;LU, KE | 主分类号 | C25D1/04 | IPC主分类号 | C25D1/04;C25C1/12;C22C1/00;C22F1/08 | 专利有效期 | A NANO CRYSTALS COPPER MATERIAL WITH SUPER HIGH STRENGTH AND CONDUCTIVITY AND METHOD OF PREPARING THEREOF 至A NANO CRYSTALS COPPER MATERIAL WITH SUPER HIGH STRENGTH AND CONDUCTIVITY AND METHOD OF PREPARING THEREOF | 法律状态 | 说明书摘要 |
The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of grown-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of grown-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This invented Cu material has a more excellent performance than existing ones. The tensile yield strength and ultimate strength of the present Cu material at room-temperature can be as high as 900 MPa and 1086 MPa, respectively, and such a high tensile strength cannot be achieved for Cu materials with the same chemical composition prepared by any traditional methods. Meanwhile, the present Cu sample also keeps a good electrical conductivity, for example, the room-temperature resistivity is (1.75+/-0.02) x 10<-8> OMEGA .m, corresponding to 96% IACS, which is close to that of conventional coarse-grained Cu. |
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