| 专利名称 | Method for bonding two solid planes via surface assembling of active functional groups | 申请号 | US20060453067 | 专利类型 | US | 公开（公告）号 | US2006289115 | 公开（授权）日 | 2006.12.28 | 申请（专利权）人 | 中国科学院长春应用化学研究所 | 发明（设计）人 | ZHAO JIANYING (CN);QIU XUEPENG (CN);GAO LIANXUN (CN);BIAN ZHENG (CN) | 主分类号 | C04B37/00 | IPC主分类号 | C04B37/00 | 专利有效期 | Method for bonding two solid planes via surface assembling of active functional groups 至Method for bonding two solid planes via surface assembling of active functional groups | 法律状态 | 说明书摘要 | The present invention belongs to a bonding technical field of biochips or micromechanical electrical devices, more specifically, to a novel method for bonding two solid planes containing silicon, oxygen, metal or other elements at a moderate temperature via surface assembling of active functional groups. The method includes the steps of: (1) cleaning and hydroxylating solid planes of silicon plate, quartz or glass; (2) aminating a hydroxylated surfaces of the substrate; (3) forming a mono-layer or multi-layer assembled film with compound monomers having an active bi-functional or multi-functional group on an aminated substrate surface; and (4) contacting two solid planes with a assembled film having the same or different active functional groups on its surface tightly, and forming covalent bonds at an appropriate temperature, pressure and a vacuum degree. Thus two solid planes are bonded with assembled films of bi-functional molecule or multi-functional molecule, thereby a bonding at molecular level of two solid planes are achieved. |
1、源头对接，价格透明
2、平台验证，实名审核
3、合同监控，代办手续
4、专员跟进，交易保障